Господдержка предприятий-производителей строительных материалов
Samsung plans to switch to glass substrates in the production of chips for artificial intelligence (AI) by 2028.
Glass will replace traditional silicon interconnect plates, which are used to connect graphics processors and fast memory. The new materials promise higher precision, better dimensional stability and, importantly, lower production costs.
The transition to glass can significantly speed up the production of chips and reduce the cost of their development, which is especially important against the backdrop of growing competition in the field of AI. Samsung, unlike other manufacturers, plans to use smaller glass plates - less than 100 by 100 mm - which will allow it to set up pilot production faster, albeit with some losses in efficiency.
For this, the company will use its production on the campus in Cheonan.
Source: www.ferra.ru